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News Coverage |
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| June 20, 2007 |
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DDR Innovator Bill Gervasi Will Head-up US Modular's Engineering Team
Award-Winning Patent Holder Has Experience in Both U.S. and International Standards for Memory Products
IRVINE, Calif.--(BUSINESS WIRE)--US Modular continues the company's aggressive growth plan by hiring award-winning patent holder and well-known engineer, Bill Gervasi. Gervasi will hold the position of Vice President of Engineering at US Modular (www.usmodular.com), a leading designer and manufacturer of personal memory, power and storage products.
Gervasi comes to US Modular with a wealth of accomplishments. He has an extensive, and impressive, background with Double Data Rate (DDR) SDRAM and was employed at Intel for over 19 years as a new product designer and Major Accounts Manager. Having worked with DDR since its inception, Gervasi will lead US Modular's engineering team to create new and advanced memory module products for the company's global accounts.
"Bill's choice to join our team confirms our strategy and vision of becoming a leading innovator focused on solutions for global OEM customers - with a key focus on memory, storage and power products," said Atticus Firey, President and COO of US Modular. "As head engineer, Bill will lead the integration of industry standards into US Modular's current technology to expand upon our robust suite of cutting-edge solutions. We are excited with Bill's choice to join our team over the other global companies that were looking to hire him."
In addition to Intel, Gervasi has held positions at Netlist and Simpletech. He has served on the JEDEC Board of Directors and chaired committees for DRAM parametrics and small form memory modules throughout the development of DDR1, DDR2, and DDR3. His long list of accomplishments also includes defining the architecture of DDR3 Registered DIMMs, driving the definition of DDR SO-DIMMs, and international standardization of four rank modules. He was instrumental in negotiating adoption of the PCI bus standard for Apple computers, bringing the PC and Mac worlds closer together.
"One of the major factors in choosing US Modular was the opportunity to work again with Randy Henniger, newly recruited VP of OEM Development," Gervasi said. "As a team with a successful track record in gaining industry acceptance for innovative memory products, Randy and I are looking forward to continuing our work together as we extend our successful track record here at US Modular."
Gervasi is the recipient of the "Technical Achievement Award" and the "Chairman Award," both from JEDEC. He has several patents in memory circuit design and packaging. He is known internationally from numerous articles and speaking presence at conferences such as Platform, JEDEX, Via Technology Forum, IMAPS, and others.
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